Mark Ming-Cheng Cheng, PhD
Electrical and Computer Engineering
Director Nano Fabrication Service Core (nFab)
Wayne State University
5050 Anthony Wayne Drive #3140
Detroit MI 48202
2D materials, Biomedical Microdevices, Bioinstrumentation, MEMS/NEMS, Energy Materials, Battery Testing, Nano manufacturing
Research opporunities are available to PhD and undergraduate students. Minority and students with disabilities are encouraged to apply. Please send your resume to email@example.com
A FIB System (TESCAN GAIA) has been installed! The equipment was purchased thanks to the generous support of the NSF MRI grant. The equipment is capable of e-beam lithography, ion milling, nano etching/ deposition, 3D chemical profiling, and TEM sample preparation. Please contact Dr. Cheng or nFab University Core for the training and access.
(6/2/2014) We welcome McNair scholars Ms. Camille Williams and Mr. Ahmedul Islam to conduct research in the lab.
(6/2/2014) We welcome NSF REU students Mrs. Marc Barbret and Michael Duric to condcut researches in the lab.
(6/21/2014) Jinho's PECVD nitride paper was accepted by Journal of Power Sources. Congratulations!
(7/2/2014) Dr. Cheng will give an invited oral presentation at Gordon Research Conference on Nanostructure Fabrication.
(2/14/2015) Wenwen's paper "A flexible and implantable microelectrode arrays using high-temperature grown vertical carbon nanotubes and a biocompatible polymer substrate" was accepted by Nanotechnology (IOP).
(2/18/2015) Peng's paper "Wireless Monitoring of Eye Intraocular Pressure Using Transparent Graphene LC Sensors", was accepted for Lecture presentation at The 2015 Joint Conference of the IEEE Int'l Frequency Control Symposium & European Frequency & Time Forum, to be held in Denver, Colorado USA from April 12-16 2015. The paper was nominated for best student award.
(2/24/2015) nFab and TESCAN are please to host a workshop "Discovering the 3D World with Scanning Electron Microscopy from Centimeters to Nanometer" at Wayne State University Feb 24-25 2015. See a flyer.